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World Industrial Showcases EMC and Overvoltage Protection Innovations at EDTEST 2025 Summit

Post time: 2025.11.08 Source: Source:Shenzhen World Industrial Co.,Ltd Views: 18

The 8th Electronic Design and Test Technology Conference and Semiconductor Device Innovation Application Summit (EDTEST 2025) was held in Shenzhen on November 8. Focusing on cutting-edge fields such as Electromagnetic Compatibility (EMC), power technology, semiconductor devices, and test & measurement, this annual event stands as a premier technical gathering in the electronic design industry.

Shenzhen World Industrial Co., Ltd. was invited to exhibit at the summit, delivering two keynote speeches aligned with industry hotspots: "Breaking Through Bottlenecks: Synergistic Optimization of EMC with Soft Bridges and Diodes" and "MOV+TSS Innovative Co-packaged Low Clamping Voltage Solution -- World Industrial's Overvoltage Protection Innovation." These presentations effectively showcased the company's latest technological achievements in the discrete components sector.

I. Booth Highlights: Fruitful Technical Exchanges

As a key exhibitor at this summit, World Industrial’s booth attracted a massive crowd, becoming the focal point for on-site technical exchanges. Throughout the event, numerous attendees visited our booth to experience our innovative products, including our core Rectifier, Power, and Protection device series. They also received comprehensive technical documentation and sample support.

"Through direct communication with engineers on-site, we have gathered extensive frontline feedback. These invaluable insights will help us further optimize our product designs," stated a technical engineer from World Industrial at the booth.

II. Technical Focus: World Industrial's Engineering Expertise

In recent years, World Industrial has continuously increased its R&D investment, consistently launching innovative products and solutions.

At this summit, Wang Weilin, Senior FAE of Shenzhen World Industrial Co., Ltd., delivered a keynote speech titled "Breaking Through Bottlenecks: Synergistic Optimization of EMC with Soft Bridges and Diodes." He provided an in-depth analysis of how to effectively resolve EMC issues through soft bridges and snubber diodes, specifically achieving significant optimization in both conducted and radiated emissions.

During the post-event networking sessions, multiple engineers noted that this technology provided fresh insights and new approaches for their ongoing projects.

Gong Wei, Product Manager (PM) of Protection Devices at Shenzhen World Industrial Co., Ltd. and the core leader of this product line, delivered a presentation titled "MOV+TSS Innovative Co-packaged Low Clamping Voltage Solution -- World Industrial's Overvoltage Protection Innovation." This presentation effectively showcased the company's innovative achievements in the field of circuit protection. Industry experts at the event noted that this innovative solution holds broad market prospects in application scenarios with stringent reliability requirements.

Through its participation in the EDTEST Technology Conference, World Industrial not only demonstrated its profound engineering expertise but also achieved deep resonance with the industry's leading forces. The unanimous recognition from attendees—that World Industrial's solutions "effectively resolve core pain points in project design"—stands as the best testament to the company's customer-centric and innovation-driven value proposition. This is just the beginning. World Industrial looks forward to joining hands with industry partners to jointly propel electronic technology toward a more reliable and advanced future.